Table of Contents
1 Table of Contents
1.1 List of Tables
1.2 List of Figures
2 Introduction
3 Memory Integrated Circuit (IC) Market
3.1 Overview
3.2 Definitions
3.2.1 Memory IC
3.2.2 Static Random Access Memory (SRAM)
3.2.3 Dynamic Random Access Memory (DRAM)
3.2.4 First-In, First-Out (FIFO) and Last-In, First-Out (LIFO) SRAM
3.2.5 Flash Memory and Electronically Erasable Programmable Read Only Memory (EEPROM)
3.2.6 Erasable Programmable Read Only Memory (EPROM)
3.2.7 Programmable Read-Only Memory (PROM)
3.2.8 Mask Programmed ROM (MROM)
3.2.9 Memory Cards
3.3 Emerging Memory Chips
3.3.1 DDR4 DRAM
3.3.2 Phase Change Memory (PRAM)
3.3.3 Ferroelectric RAM (FeRAM, F-RAM or FRAM)
3.3.4 Magnetoresistive Random Access Memory (MRAM)
3.3.5 Resistive Random Access Memory (ReRAM)
3.4 Comparison of Key Memory ICs by Key Features
4 Memory ICs, End-Applications
4.1.1 SRAM, End-Applications
4.1.2 Flash Memory, End-Applications
4.1.3 DRAM, End-Applications
5 Memory IC Market, Technological Developments
5.1 Hybrid Memory Cube
5.1.1 3D Stack Technique
5.1.2 3D-IC Through Silicon Via (TSV)
5.2 High Density PRAM
6 Memory IC Market, Industry Dynamics
6.1 Key Market Drivers
6.1.1 Smartphones and Tablet PCs Drive the Mobile Memory Market
6.1.2 Ultrabooks to Increase the Consumption of Memory ICs in PC Segment
6.1.3 Increase in Demand for Memory Chips for Automobile Applications
6.1.4 Increasing Adoption of Cloud Computing and Data Centers Fuelling the Growth of Memory IC
6.2 Key Market Restraints
6.2.1 High R&D and Capital Expenditure Impede Technology Innovations
6.3 Key Market Challenges
6.3.1 Bringing in Balance between DRAM Supply and Demand
6.3.2 Lack of Strong SRAM Product
6.3.3 Higher Density NAND Flash Chips
6.3.4 Natural Disasters Limit the Shipments of the Memory Chips
6.4 Future Trends
6.4.1 Potential of ReRAM to Replace DRAM, Flash Memory and Hard Drives
6.4.2 MRAM May Replace DRAM and Flash Memory
6.4.3 FRAM - Embedded Memory Alternative for MCUs Application
7 Global Memory IC Market- Five Force Analysis
7.1 DRAM, Porter’s Five Forces Analysis
7.2 Flash Memory, Porter’s Five Forces Analysis
7.3 SRAM, Porter’s Five Forces Analysis
8 Global Memory IC Market Analysis and Forecasts
8.1 Sales Revenue
8.2 Sales Volume
9 Memory IC Market Analysis by Geography
9.1 Memory IC Market Breakdown by Geography, 2011
9.2 Americas
9.3 EMEA
9.4 APAC
9.5 Japan
10 Memory IC Market Analysis by End-Application
10.1 Memory IC Market Breakdown by End-Application, 2011
10.2 IT/Computers
10.3 Communications
10.4 Consumer Electronics
10.5 Industrial and Automotive
10.6 Other Applications
11 Memory IC Market Analysis by Product Types
11.1 Memory IC Market Breakdown by Product Types, 2011
11.2 DRAM Market
11.3 Flash Memory Market
11.4 SRAM Market
11.5 Other Memory Types
12 DRAM Market Analysis and Forecasts
12.1 DRAM Market Analysis by Product Types
12.1.1 DDR DRAM Market
12.1.2 DDR2 DRAM Market
12.1.3 DDR3 DRAM Market
12.1.4 DRR4 DRAM Market
12.1.5 Other DRAMs Market
12.2 DRAM Market Analysis by Geography
12.2.1 Americas
12.2.2 EMEA
12.2.3 APAC
12.2.4 Japan
12.3 DRAM Market Analysis by End-Application
12.3.1 IT/Computers
12.3.2 Communications
12.3.3 Consumer Electronics
12.3.4 Industrial and Auto
12.3.5 Other Applications
13 Flash Memory Market Analysis and Forecasts
13.1 Flash Market Analysis by Product Types
13.1.1 NAND Market, Global
13.1.2 NAND Market Breakdown by Product Types, 2011
13.1.3 NOR Market
13.2 Flash Market Analysis by Geography
13.2.1 Americas
13.2.2 EMEA
13.2.3 APAC
13.2.4 Japan
13.3 Flash Market Analysis by End-Application
13.3.1 IT/Computers
13.3.2 Communications
13.3.3 Consumer Electronics
13.3.4 Industrial and Auto
13.3.5 Others Applications
14 Memory IC Market, Key Suppliers
14.1 Memory IC Market - Competitive Landscape
14.2 Memory ICs, Market Share
14.2.1 DRAM
14.2.2 Flash Memory
14.2.3 SRAM
15 Memory IC Market, Key Company Profiles
15.1 Samsung Electronics
15.1.1 Samsung Electronics – Business Description
15.1.2 Samsung Electronics – Key Memory Products
15.1.3 Samsung Electronics – SWOT
15.1.4 Samsung Electronics – Latest Developments
15.1.5 Samsung Electronics – Mergers and Acquisitions
15.2 SK Hynix Inc
15.2.1 SK Hynix Inc – Business Description
15.2.2 SK Hynix Inc – Key Products
15.2.3 SK Hynix Inc – SWOT
15.2.4 SK Hynix Inc – Latest Developments
15.3 Toshiba Corporation
15.3.1 Toshiba Corporation – Business Description
15.3.2 Toshiba Corporation – Key Memory Products
15.3.3 Toshiba Corporation – SWOT
15.3.4 Toshiba Corporation – Latest Developments
15.3.5 Toshiba Corporation – Mergers and Acquisitions
15.4 Micron Technology, Inc
15.4.1 Micron Technology, Inc – Business Description
15.4.2 Micron Technology, Inc – Key Products
15.4.3 Micron Technology, Inc – SWOT
15.4.4 Micron Technology, Inc – Latest Developments
15.4.5 Micron Technology, Inc – Mergers and Acquisitions
15.5 Cypress Semiconductor Corporation
15.5.1 Cypress Semiconductor Corp – Business Description
15.5.2 Cypress Semiconductor Corp – Key Memory Products
15.5.3 Cypress Semiconductor Corp – SWOT
15.5.4 Cypress Semiconductor Corp – Latest Developments
15.6 Nanya Technology Corporation
15.6.1 Nanya Technology Corporation – Business Description
15.6.2 Nanya Technology Corporation – Key Products
15.6.3 Nanya Technology Corporation – SWOT
15.6.4 Nanya Technology Corporation – Latest Developments
16 Appendix
16.1 About GBI Research
16.2 Glossary of Terms
16.3 Bibliography
16.4 Methodology
16.4.1 Market Size Estimates
16.4.2 Market Size Forecasts
16.4.3 Geographies Discussed
16.4.4 Coverage
16.4.5 Secondary Research
16.4.6 Primary Research
16.4.7 Expert Panel Validation
16.5 Contact Us
16.6 Disclaimer